Cartridge for e-vaping device with open-microchannels

ABSTRACT

A cartridge for an e-vaping device includes a reservoir configured to hold a pre-vapor formulation and a channel structure that includes a channel surface with one or more open-microchannels. An open-microchannel in the channel structure may be in fluid communication with the reservoir and may transport pre-vapor formulation from the reservoir to a heating element based on capillary action of the pre-vapor formulation through the open-microchannels. The heating element may vaporize the pre-vapor formulation drawn through one or more open-microchannels. The cartridge may be independent of fibrous dispensing interfaces, including one or more wicks. Fabrication of such a cartridge may be simplified, faster, cheaper, some combination thereof, or the like relative to fabrication of a cartridge that includes a fibrous or soft dispensing interface to draw pre-vapor formulation from a reservoir to a heating element.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a Divisional application of U.S. application Ser.No. 15/192,052, filed Jun. 24, 2016, the entire contents of which isincorporated herein by reference.

BACKGROUND Field

The present disclosure relates to electronic vaping and/or e-vapingdevices.

Description of Related Art

E-vaping devices, also referred to herein as electronic vaping devices(EVDs) may be used by adult vapers for portable vaping. Flavored vaporswithin an e-vaping device may be used to deliver a flavor along with thevapor that may be produced by the e-vaping device.

In some cases, e-vaping devices may hold pre-vapor formulations within areservoir and may form a vapor based on drawing pre-vapor formulationfrom the reservoir and applying heat to the drawn pre-vapor formulationto vaporize same.

In some cases, residues may accumulate within an e-vaping device basedon the formation of vapor therein. Such residues may be formed based onelements of a pre-vapor formulation material adhering to one or morematerials in the e-vaping device. For example, where an e-vaping deviceincludes a soft or fibrous wick to draw pre-vapor formulation from areservoir to a heating element, residues may accumulate on or in thewick. Residue accumulation may adversely affect e-vaping deviceperformance, based on affecting the rate of vapor formation, increasingthe probability of chemical reactions between the residue and one ormore elements of the e-vaping device, affecting the elements included ina formed vapor, affecting the amount of vapor formed by the e-vapingdevice during vapings, some combination thereof, or the like.

In some cases, e-vaping devices may be manufactured via mass-production.Such mass-production may be at least partially automated. In some cases,a complexity of e-vaping devices may have an adverse effect on at leastone of the consistency of e-vaping device manufacturing quality, speedof e-vaping device manufacture, and cost of e-vaping device manufacture.

SUMMARY

According to some example embodiments, a cartridge for an e-vapingdevice may include a reservoir configured to hold a pre-vaporformulation, a channel structure, and at least one heating element. Thechannel structure may include a channel surface. The channel surface mayinclude a first channel surface portion and an adjacent second channelsurface portion. The first channel surface portion may define at leastone inner surface of the reservoir. The second channel surface portionmay be external to the reservoir. The channel surface may include atleast one open-microchannel. The at least one open-microchannel mayextend between the first channel surface portion and the second channelsurface portion. The channel structure may be configured to draw thepre-vapor formulation from the reservoir to the second channel surfaceportion based on capillary action of the pre-vapor formulation throughthe at least one open-microchannel. The at least one heating element maybe configured to vaporize the pre-vapor formulation drawn to the secondchannel surface portion to form a vapor.

The at least one open-microchannel may have a trapezoidal channelcross-section.

The channel structure may include a hydrophilic layer on the channelsurface.

The heating element may include a surface heater.

The heating element may be coupled to the second channel surface portionof the channel structure.

The reservoir may include a sealing element configured to substantiallyseal an interface between the reservoir and the second channel surfaceportion.

The cartridge may include a plurality of reservoirs. Each of thereservoirs may be configured to hold at least one pre-vapor formulation.The at least one open-microchannel may include a plurality ofopen-microchannels. Each of the open-microchannels may be in fluidcommunication with a separate reservoir of the plurality of reservoirs.

The reservoir may be an annular structure configured to hold thepre-vapor within the annular structure. The channel structure may be adisc structure, the first channel surface portion being an outer annularportion of the channel surface and defines a base of the annularstructure, and the second channel surface portion being an inner portionof the channel surface. The at least one open-microchannel may extendradially between the outer annular portion of the channel surface andthe inner portion of the channel surface. The at least one heatingelement may be coupled to the inner portion of the channel structure.

The channel structure may include a tubular structure. The channelsurface may include an outer surface of the tubular structure. The atleast one open-microchannel may extend axially along the outer surfaceof the tubular structure.

The channel structure may be a molded structure.

The cartridge may include a wicking material in contact with the secondchannel surface portion and the heating element. The wicking materialbeing configured to draw pre-vapor formulation from the at least oneopen-microchannel in the second channel surface portion to the heatingelement.

According to some example embodiments, an e-vaping device may include acartridge for an e-vaping device and a power supply configured to supplyelectrical power to the cartridge. The cartridge may include a reservoirconfigured to hold a pre-vapor formulation, a channel structure, and atleast one heating element. The channel structure may include a channelsurface. The channel surface may include a first channel surface portionand an adjacent second channel surface portion. The first channelsurface portion may define at least one inner surface of the reservoir.The second channel surface portion may be external to the reservoir. Thechannel surface may include at least one open-microchannel. The at leastone open-microchannel may extend between the first channel surfaceportion and the second channel surface portion. The channel structuremay be configured to draw the pre-vapor formulation from the reservoirto the second channel surface portion based on capillary action of thepre-vapor formulation through the at least one open-microchannel. The atleast one heating element may be configured to vaporize the pre-vaporformulation drawn to the second channel surface portion to form a vapor.

The at least one open-microchannel may have a trapezoidal channelcross-section.

The channel structure may include a hydrophilic layer on the channelsurface.

The heating element may include a surface heater.

The heating element may be coupled to the second channel surface portionof the channel structure.

The reservoir may include a sealing element configured to substantiallyseal an interface between the reservoir and the second channel surfaceportion.

The e-vaping device may include a plurality of reservoirs. Each of thereservoirs may be configured to hold at least one pre-vapor formulation.The at least one open-microchannel may include a plurality ofopen-microchannels. Each of the open-microchannels may be in fluidcommunication with a separate reservoir of the plurality of reservoirs.

The reservoir may be an annular structure configured to hold thepre-vapor within the annular structure. The channel structure may be adisc structure. The first channel surface portion may be an outerannular portion of the channel surface and define a base of the annularstructure. The second channel surface portion may be an inner portion ofthe channel surface. The at least one open-microchannel may extendradially between the outer annular portion of the channel surface andthe inner portion of the channel surface. The at least one heatingelement may be coupled to the inner portion of the channel structure.

The channel structure may include a tubular structure. The channelsurface may include an outer surface of the tubular structure. The atleast one open-microchannel may extend axially through the outer surfaceof the tubular structure.

The channel structure may be a molded structure.

The power supply may include a rechargeable battery.

The cartridge and the power supply may be removably connected together.

The cartridge may further include a wicking material in contact with thesecond channel surface portion and the heating element. The wickingmaterial may be configured to draw pre-vapor formulation from the atleast one open-microchannel in the second channel surface portion to theheating element.

According to some example embodiments, a method may include: drawing apre-vapor formulation from a reservoir to a heating element through atleast one open-microchannel, the at least one open-microchannelincluding a first portion and a second portion, the first portion beingin fluid communication with the reservoir, the second portion beingcoupled to the heating element; and vaporizing the pre-vapor formulationdrawn to the heating element through the at least one open-microchannelto form a vapor.

The method may further include drawing the pre-vapor formulation to theheating element through a plurality of parallel open-microchannels.

The method may further include: drawing a plurality of pre-vaporformulations from a plurality of reservoirs to at least one heatingelement through a plurality of open-microchannels, each of theopen-microchannels being in fluid communication with a separatereservoir of the plurality of reservoirs; and vaporizing the pre-vaporformulations drawn to the at least one heating element through theplurality of open-microchannels to form at least one vapor.

BRIEF DESCRIPTION OF THE DRAWINGS

The various features and advantages of the non-limiting embodimentsherein may become more apparent upon review of the detailed descriptionin conjunction with the accompanying drawings. The accompanying drawingsare merely provided for illustrative purposes and should not beinterpreted to limit the scope of the claims. The accompanying drawingsare not to be considered as drawn to scale unless explicitly noted. Forpurposes of clarity, various dimensions of the drawings may have beenexaggerated.

FIG. 1A is a side view of an e-vaping device according to some exampleembodiments.

FIG. 1B is a cross-sectional view along line IB-IB′ of the e-vapingdevice of FIG. 1A.

FIG. 2A is a perspective view of a vaporizer assembly according to someexample embodiments.

FIG. 2B is a cross-sectional view along line IIB-IIB′ of the vaporizerassembly of FIG. 2A.

FIG. 2C is a cross-sectional view along line IIC-IIC′ of the vaporizerassembly of FIG. 2A.

FIG. 3 is a perspective view of a vaporizer assembly according to someexample embodiments.

FIG. 4A is a cross-sectional view of a vaporizer assembly according tosome example embodiments.

FIG. 4B is a perspective view of section A of the vaporizer assembly ofFIG. 4A.

FIG. 5 is a perspective cross-sectional view of a vaporizer assemblyaccording to some example embodiments.

FIG. 6A, FIG. 6B, FIG. 6C, and FIG. 6D are cross-sectional views ofopen-microchannels according to some example embodiments.

FIG. 7 is a cross-sectional view of an open-microchannel and ahydrophilic layer according to some example embodiments.

FIG. 8 is a perspective view of a vaporizer assembly according to someexample embodiments.

FIG. 9A, FIG. 9B, FIG. 9C, and FIG. 9D are perspective views ofvaporizer assemblies according to some example embodiments.

FIG. 10 is a flowchart illustrating a method for forming a vaporaccording to some example embodiments.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

Some detailed example embodiments are disclosed herein. However,specific structural and functional details disclosed herein are merelyrepresentative for purposes of describing example embodiments. Exampleembodiments may, however, be embodied in many alternate forms and shouldnot be construed as limited to only the example embodiments set forthherein.

Accordingly, while example embodiments are capable of variousmodifications and alternative forms, example embodiments thereof areshown by way of example in the drawings and will herein be described indetail. It should be understood, however, that there is no intent tolimit example embodiments to the particular forms disclosed, but to thecontrary, example embodiments are to cover all modifications,equivalents, and alternatives falling within the scope of exampleembodiments. Like numbers refer to like elements throughout thedescription of the figures.

It should be understood that when an element or layer is referred to asbeing “on,” “connected to,” “coupled to,” or “covering” another elementor layer, it may be directly on, connected to, coupled to, or coveringthe other element or layer or intervening elements or layers may bepresent. In contrast, when an element is referred to as being “directlyon,” “directly connected to,” or “directly coupled to” another elementor layer, there are no intervening elements or layers present. Likenumbers refer to like elements throughout the specification. As usedherein, the term “and/or” includes any and all combinations of one ormore of the associated listed items.

It should be understood that, although the terms first, second, third,etc. may be used herein to describe various elements, elements, regions,layers and/or sections, these elements, elements, regions, layers,and/or sections should not be limited by these terms. These terms areonly used to distinguish one element, element, region, layer, or sectionfrom another region, layer, or section. Thus, a first element, element,region, layer, or section discussed below could be termed a secondelement, element, region, layer, or section without departing from theteachings of example embodiments.

Spatially relative terms (e.g., “beneath,” “below,” “lower,” “above,”“upper,” and the like) may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It should be understood thatthe spatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” may encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein interpreted accordingly.

The terminology used herein is for the purpose of describing variousexample embodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an,” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“includes,” “including,” “comprises,” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or elements, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, elements, and/or groups thereof.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of exampleembodiments. As such, variations from the shapes of the illustrations asa result, for example, of manufacturing techniques and/or tolerances,are to be expected. Thus, example embodiments should not be construed aslimited to the shapes of regions illustrated herein but are to includedeviations in shapes that result, for example, from manufacturing.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which example embodiments belong. Itwill be further understood that terms, including those defined incommonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of the relevant artand will not be interpreted in an idealized or overly formal senseunless expressly so defined herein.

FIG. 1A is a side view of an e-vaping device 60 according to someexample embodiments. FIG. 1B is a cross-sectional view along line IB-IB′of the e-vaping device of FIG. 1A. The e-vaping device 60 may includeone or more of the features set forth in U.S. Patent ApplicationPublication No. 2013/0192623 to Tucker et al. filed Jan. 31, 2013 andU.S. Patent Application Publication No. 2013/0192619 to Tucker et al.filed Jan. 14, 2013, the entire contents of each of which areincorporated herein by reference thereto. As used herein, the term“e-vaping device” is inclusive of all types of electronic vapingdevices, regardless of form, size or shape.

Referring to FIG. 1A and FIG. 1B, an e-vaping device 60 includes areplaceable cartridge (or first section) 70 and a reusable power supplysection (or second section) 72. The sections 70, 72 may be coupledtogether at complimentary interfaces 74, 84 of the respective sections70, 72.

In some example embodiments, the interfaces 74, 84 are threadedconnectors. It should be appreciated that an interface 74, 84 may be anytype of connector, including, without limitation, a snug-fit, detent,clamp, bayonet, and/or clasp.

As shown in FIG. 1A and FIG. 1B, in some example embodiments, an outletend insert 20 may be positioned at an outlet end of the cartridge 70.The outlet end insert 20 includes at least one outlet port 21 that maybe located off-axis from the longitudinal axis of the e-vaping device60. One or more of the outlet ports 21 may be angled outwardly inrelation to the longitudinal axis of the e-vaping device 60. Multipleoutlet ports 21 may be uniformly or substantially uniformly distributedabout the perimeter of the outlet end insert 20 so as to substantiallyuniformly distribute vapor drawn through the outlet end insert 20 duringvaping. Thus, as a vapor 95 is drawn through the outlet end insert 20,the vapor may move in different directions.

The cartridge 70 includes an outer housing 16 extending in alongitudinal direction. The power supply section 72 includes an outerhousing 17 extending in a longitudinal direction. In some exampleembodiments, the outer housing 16 may be a single tube housing both thecartridge 70 and the power supply section 72, and the entire e-vapingdevice 60 may be disposable. The outer housing 16 may have a generallycylindrical cross-section. In some example embodiments, the outerhousing 16 may have a generally triangular cross-section along one ormore of the cartridge 70 and the power supply section 72. In someexample embodiments, the outer housing 16 may have a greatercircumference or dimensions at a tip end than at an outlet end of thee-vaping device 60.

Still referring to FIGS. 1A-B, the cartridge 70 includes a vaporizerassembly 22 configured to form a vapor 95 based on vaporization of apre-vapor formulation. The vaporizer assembly 22 includes at least areservoir 24, a channel structure 25, and a heating element 28. Thereservoir 24 is configured to hold a pre-vapor formulation. The channelstructure 25 is configured to draw pre-vapor formulation from thereservoir 24. The heating element 28 is configured to vaporize the drawnpre-vapor formulation to form the vapor 95. The vaporizer assembly 22will be described further below with reference to at least FIGS. 2A-C,FIG. 3, and FIG. 4.

The reservoir 24 may hold a pre-vapor formulation within an interior ofthe reservoir 24. The channel structure 25 is coupled to the reservoir24, such that at least a portion of the channel structure 25 is in fluidcommunication with the reservoir 24 interior. The channel structure 25may include one or more materials, including a metal material, a plasticmaterial, some combination thereof, or the like. For example, thechannel structure 25 may at least partially or entirely includepolytetrafluoroethylene (PTFE). The channel structure 25 may include ahydrophilic material, a moldable material, some combination thereof, orthe like. For example, the channel structure 25 may include ahydrophilic injection moldable material. A hydrophilic injectionmoldable material may include Poly(methyl methacrylate) (PMMA),polyvinyl alcohol (PVA), polylactic acid (PLA), some combinationthereof, or the like.

As discussed further below, the channel structure 25 is configured todraw pre-vapor formulation from the reservoir to one or more portions ofthe channel structure 25 that are external to the reservoir 24. Thechannel structure 25 may include one or more open-microchannels that areconfigure to draw pre-vapor formulation from the reservoir 24 based oncapillary action of the pre-vapor formulation in the open-microchannels.

The heating element 28 is positioned proximate to a portion of thechannel structure 25 to which pre-vapor formulation may be drawn fromthe reservoir 24. The heating element 28 may be coupled to the portionof the channel structure 25 to which pre-vapor formulation may be drawnfrom the reservoir 24. As shown in the example embodiments illustratedin FIG. 1B, the heating element 28 may extend on a surface of thechannel structure 25. In some example embodiments, the heating element28 may extend parallel or transverse (orthogonal, perpendicular, etc.)to a longitudinal axis of the channel structure 25.

The heating element 28 is configured to generate heat. The channelstructure 25 is configured to draw pre-vapor formulation from thereservoir 24, such that the pre-vapor formulation may be vaporized fromthe channel structure 25 based on heating of the channel structure 25 bythe heating element 28.

During vaping, pre-vapor formulation may be transferred from thereservoir 24 via capillary action of one or more open-microchannels (notshown in FIGS. 1A-B) of the channel structure 25. The heating element 28may at least partially surround a portion of the channel structure 25such that if and/or when the heating element 28 is activated to generateheat, the pre-vapor formulation in the portions of one or moreopen-microchannels that extend through the portion of the channelstructure 25 may be vaporized by the heating element 28 to form a vapor.

In some example embodiments, at least one air inlet port 44 may beformed in the outer housing 16, adjacent to the interface 74 to minimizethe probability of an adult vaper's fingers occluding one of the portsand to control the resistance-to-draw (RTD) during vaping. In someexample embodiments, the air inlet ports 44 may be machined into theouter housing 16 with precision tooling such that their diameters areclosely controlled and replicated from one e-vaping device 60 to thenext during manufacture.

In some example embodiments, the air inlet ports 44 may be drilled withcarbide drill bits or other high-precision tools and/or techniques. Insome example embodiments, the outer housing 16 may be formed of metal ormetal alloys such that the size and shape of the air inlet ports 44 maynot be altered during manufacturing operations, packaging, and vaping.Thus, the air inlet ports 44 may provide consistent RTD. In some exampleembodiments, the air inlet ports 44 may be sized and configured suchthat the e-vaping device 60 has a RTD in the range of from about 40 mmH₂O to about 150 mm H₂O.

One or more elements of the cartridge 70 define internal spaces 42 and46 within the cartridge 70 interior. As shown, the cartridge 70 interiorincludes spaces 42 that are at least partially defined by the outerhousing 16 of the cartridge 70 and one or more elements of the vaporizerassembly 22. The cartridge interior further includes space 46 that is atleast partially defined by the outer housing 16, vaporizer assembly 22,and the outlet end insert 20. Internal spaces 42 are each in fluidcommunication with one or more air inlet ports 44. Internal space 46 isin fluid communication with one or more air inlet ports 21. The internalspaces 42 may be referred to as one or more upstream portions of thecartridge 70 interior. The internal space 46 may be referred to as adownstream portion of the cartridge 70 interior. Air 94 may be drawninto spaces 42 via the one or more air inlet ports 44. Vapor 95 formedby the vaporizer assembly 22 may be released into at least one of spaces42 and 46. At least the vapor 95 and air 94 may be drawn through the airoutlet ports 21 through space 46.

In the example embodiments illustrated in FIGS. 1A-B, the air inletports 44 are located downstream of at least a portion of the vaporizerassembly 22. The air inlet ports 44 may be configured to direct air 94into spaces 42 that are at in fluid communication with a portion of thechannel structure 25 at which vapor 95 may be formed. For example, asshown in FIG. 1B, the air inlet ports 44 are positioned upstream of theheating element 28, so that air 94 drawn through the air inlet ports 44into spaces 42 may pass in fluid communication with a portion of thechannel structure 25 that is proximate to the heating element 28. Vapor95 formed by the vaporizer assembly 22 may mix with the air 94. At leastone of the vapor 95 and air 94 may pass downstream, through space 46, toexit the cartridge 70 through one or more of the air outlet ports 21.

In some example embodiments, the cartridge 70 includes a connectorelement 91. Connector element 91 may include one or more of a cathodeconnector element and an anode connector element. In the exampleembodiment illustrated in FIG. 1B, for example, electrical lead 26-1 iscoupled to the connector element 91. As further shown in FIG. 1B, theconnector element 91 is configured to couple with a power supply 12included in the power supply section 72. If and/or when interfaces 74,84 are coupled together, the connector element 91 and power supply 12may be coupled together. Coupling connector element 91 and power supply12 together may electrically couple lead 26-1 and power supply 12together.

In some example embodiments, one or more of the interfaces 74, 84include one or more of a cathode connector element and an anodeconnector element. In the example embodiment illustrated in FIG. 1B, forexample, electrical lead 26-2 is coupled to the interface 74. As furthershown in FIG. 1B, the power supply section 72 includes a lead 92 thatcouples the control circuitry 11 to the interface 84. If and/or wheninterfaces 74, 84 are coupled together, the coupled interfaces 74, 84may electrically couple leads 26-2 and 92 together.

If and/or when interfaces 74, 84 are coupled together, one or moreelectrical circuits through the cartridge 70 and power supply section 72may be established. The established electrical circuits may include atleast the heating element 28, the control circuitry 11, and the powersupply 12. The electrical circuit may include electrical leads 26-1 and26-2, lead 92, and interfaces 74, 84.

The connector element 91 may include an insulating material 91 b and aconductive material 91 a. The conductive material 91 a may electricallycouple lead 26-1 to power supply 12, and the insulating material 91 bmay insulate the conductive material 91 a from the interface 74, suchthat a probability of an electrical short between the lead 26-1 and theinterface 74 is reduced and/or prevented. For example, if and/or whenthe connector element 91 includes a cylindrical cross-section orthogonalto a longitudinal axis of the e-vaping device 60, the insulatingmaterial 91 b included in connector element 91 may be in an outerannular portion of the connector element 91 and the conductive material91 a may be in an inner cylindrical portion of the connector element 91,such that the insulating material 91 b surrounds the conductive material91 a and reduces and/or prevents a probability of an electricalconnection between the conductive material 91 a and the interface 74.

Still referring to FIG. 1A and FIG. 1B, the power supply section 72includes a sensor 13 responsive to air drawn into the power supplysection 72 via an air inlet port 44 a adjacent to a free end or tip endof the e-vaping device 60, at least one power supply 12, and controlcircuitry 11. The power supply 12 may include a rechargeable battery.The sensor 13 may be one or more of a pressure sensor, amicroelectromechanical system (MEMS) sensor, etc.

In the illustrated embodiments shown in FIGS. 1A-B, the sensor 13 andcontrol circuitry 11 are located proximate to a tip end of the powersupply section 72. It will be understood that, in some exampleembodiments, one or more of the sensor 13 and the control circuitry 11may be located in one or more different locations in the power supplysection 72, including one or more locations that are different from thetip end of the power supply section 72. For example, in some exampleembodiments, one or more of the control circuitry 11 and the sensor 13may be located proximate to an outlet end of the power supply section72.

In some example embodiments, the power supply 12 includes a batteryarranged in the e-vaping device 60 such that the anode is downstream ofthe cathode. A connector element 91 contacts the downstream end of thebattery. The heating element 28 is connected to the power supply 12 byat least electrical lead 26-1 and connector element 91 if and/or wheninterfaces 74, 84 are coupled together.

The power supply 12 may be a Lithium-ion battery or one of its variants,for example a Lithium-ion polymer battery. Alternatively, the powersupply 12 may be a nickel-metal hydride battery, a nickel cadmiumbattery, a lithium-manganese battery, a lithium-cobalt battery or a fuelcell. The e-vaping device 60 may be usable by an adult vaper until theenergy in the power supply 12 is depleted or in the case of lithiumpolymer battery, a minimum voltage cut-off level is achieved.

Further, the power supply 12 may be rechargeable and may includecircuitry configured to allow the battery to be chargeable by anexternal charging device. To recharge the e-vaping device 60, aUniversal Serial Bus (USB) charger or other suitable charger assemblymay be used.

Upon completing the connection between the cartridge 70 and the powersupply section 72, the at least one power supply 12 may be electricallyconnected with the heating element 28 of the cartridge 70 upon actuationof the sensor 13. Air is drawn primarily into the cartridge 70 throughone or more air inlet ports 44. The one or more air inlet ports 44 maybe located along the outer housing 16, 17 of the first and secondsections 70, 72 or at one or more of the coupled interfaces 74, 84.

The sensor 13 may be configured to sense an air pressure drop andinitiate application of voltage from the power supply 12 to the heatingelement 28. As shown in the example embodiment illustrated in FIG. 1B,some example embodiments of the power supply section 72 include a heateractivation light 48 configured to glow if and/or when the heatingelement 28 is activated. The heater activation light 48 may include alight emitting diode (LED). Moreover, the heater activation light 48 maybe arranged to be visible to an adult vaper during vaping. In addition,the heater activation light 48 may be utilized for e-vaping systemdiagnostics or to indicate that recharging is in progress. The heateractivation light 48 may also be configured such that the adult vaper mayactivate and/or deactivate the heater activation light 48 for privacy.As shown in FIG. 1A and FIG. 1B, the heater activation light 48 may belocated on the tip end of the e-vaping device 60. In some exampleembodiments, the heater activation light 48 may be located on a sideportion of the outer housing 17.

In addition, the at least one air inlet port 44 a may be locatedadjacent to the sensor 13, such that the sensor 13 may sense air flowindicative of vapor being drawn through the outlet end of the e-vapingdevice. The sensor 13 may activate the power supply 12 and the heateractivation light 48 to indicate that the heating element 28 isactivated.

Further, the control circuitry 11 may control the supply of electricalpower to the heating element 28 responsive to the sensor 13. In someexample embodiments, the control circuitry 11 may include a maximum,time-period limiter. In some example embodiments, the control circuitry11 may include a manually operable switch for an adult vaper to manuallyinitiate vaping. The time-period of the electric current supply to theheating element 28 may be pre-set depending on the amount of pre-vaporformulation desired to be vaporized. In some example embodiments, thecontrol circuitry 11 may control the supply of electrical power to theheating element 28 as long as the sensor 13 detects a pressure drop.

To control the supply of electrical power to a heating element 28, thecontrol circuitry 11 may execute one or more instances ofcomputer-executable program code. The control circuitry 11 may include aprocessor and a memory. The memory may be a computer-readable storagemedium storing computer-executable code.

The control circuitry 11 may include processing circuitry including, butnot limited to, a processor, Central Processing Unit (CPU), acontroller, an arithmetic logic unit (ALU), a digital signal processor,a microcomputer, a field programmable gate array (FPGA), aSystem-on-Chip (SoC), a programmable logic unit, a microprocessor, orany other device capable of responding to and executing instructions ina defined manner. In some example embodiments, the control circuitry 11may be at least one of an application-specific integrated circuit (ASIC)and an ASIC chip.

The control circuitry 11 may be configured as a special purpose machineby executing computer-readable program code stored on a storage device.The program code may include program or computer-readable instructions,software elements, software modules, data files, data structures, and/orthe like, capable of being implemented by one or more hardware devices,such as one or more of the control circuitry mentioned above. Examplesof program code include both machine code produced by a compiler andhigher level program code that is executed using an interpreter.

The control circuitry 11 may include one or more storage devices. Theone or more storage devices may be tangible or non-transitorycomputer-readable storage media, such as random access memory (RAM),read only memory (ROM), a permanent mass storage device (such as a diskdrive), solid state (e.g., NAND flash) device, and/or any other likedata storage mechanism capable of storing and recording data. The one ormore storage devices may be configured to store computer programs,program code, instructions, or some combination thereof, for one or moreoperating systems and/or for implementing the example embodimentsdescribed herein. The computer programs, program code, instructions, orsome combination thereof, may also be loaded from a separate computerreadable storage medium into the one or more storage devices and/or oneor more computer processing devices using a drive mechanism. Suchseparate computer readable storage medium may include a USB flash drive,a memory stick, a Blu-ray/DVD/CD-ROM drive, a memory card, and/or otherlike computer readable storage media. The computer programs, programcode, instructions, or some combination thereof, may be loaded into theone or more storage devices and/or the one or more computer processingdevices from a remote data storage device via a network interface,rather than via a local computer readable storage medium. Additionally,the computer programs, program code, instructions, or some combinationthereof, may be loaded into the one or more storage devices and/or theone or more processors from a remote computing system that is configuredto transfer and/or distribute the computer programs, program code,instructions, or some combination thereof, over a network. The remotecomputing system may transfer and/or distribute the computer programs,program code, instructions, or some combination thereof, via a wiredinterface, an air interface, and/or any other like medium.

The control circuitry 11 may be a special purpose machine configured toexecute the computer-executable code to control the supply of electricalpower to the heating element 28. Controlling the supply of electricalpower to the heating element 28 may be referred to hereininterchangeably as activating the heating element 28.

Still referring to FIG. 1A and FIG. 1B, if and/or when the heatingelement 28 is activated, the activated heating element 28 may heat aportion of a channel structure 25 for less than about 10 seconds. Thus,the power cycle (or maximum vaping length) may range in period fromabout 2 seconds to about 10 seconds (e.g., about 3 seconds to about 9seconds, about 4 seconds to about 8 seconds or about 5 seconds to about7 seconds).

The pre-vapor formulation is a material or combination of materials thatmay be transformed into a vapor. For example, the pre-vapor formulationmay be a liquid, solid and/or gel formulation including, but not limitedto, water, beads, solvents, active ingredients, ethanol, plant extracts,natural or artificial flavors, and/or vapor formers such as glycerin andpropylene glycol.

In some example embodiments, the pre-vapor formulation is one or more ofpropylene glycol, glycerin and combinations thereof.

The pre-vapor formulation may include nicotine or may exclude nicotine.The pre-vapor formulation may include one or more tobacco flavors. Thepre-vapor formulation may include one or more flavors which are separatefrom one or more tobacco flavors.

In some example embodiments, a pre-vapor formulation that includesnicotine may also include one or more acids. The one or more acids maybe one or more of pyruvic acid, formic acid, oxalic acid, glycolic acid,acetic acid, isovaleric acid, valeric acid, propionic acid, octanoicacid, lactic acid, levulinic acid, sorbic acid, malic acid, tartaricacid, succinic acid, citric acid, benzoic acid, oleic acid, aconiticacid, butyric acid, cinnamic acid, decanoic acid,3,7-dimethyl-6-octenoic acid, 1-glutamic acid, heptanoic acid, hexanoicacid, 3-hexenoic acid, trans-2-hexenoic acid, isobutyric acid, lauricacid, 2-methylbutyric acid, 2-methylvaleric acid, myristic acid,nonanoic acid, palmitic acid, 4-penenoic acid, phenylacetic acid,3-phenylpropionic acid, hydrochloric acid, phosphoric acid, sulfuricacid and combinations thereof.

In some example embodiments, a vapor 95 formed at the vaporizer assembly22 may be substantially free of one or more materials being in a gasphase. For example, the vapor 95 may include one or more materialssubstantially in a particulate phase and substantially not in a gasphase.

The storage medium of the reservoir 24 may be a fibrous materialincluding at least one of cotton, polyethylene, polyester, rayon andcombinations thereof. The fibers may have a diameter ranging in sizefrom about 6 microns to about 15 microns (e.g., about 8 microns to about12 microns or about 9 microns to about 11 microns). The storage mediummay be a sintered, porous or foamed material. Also, the fibers may besized to be irrespirable and may have a cross-section which has aY-shape, cross shape, clover shape or any other suitable shape. In someexample embodiments, the reservoir 24 may include a filled tank lackingany storage medium and containing only pre-vapor formulation.

The reservoir 24 may be sized and configured to hold enough pre-vaporformulation such that the e-vaping device 60 may be configured forvaping for at least about 200 seconds. The e-vaping device 60 may beconfigured to allow each vaping to last a maximum of about 5 seconds.

The heating element 28 may be formed of any suitable electricallyresistive materials. Examples of suitable electrically resistivematerials may include, but not limited to, titanium, zirconium, tantalumand metals from the platinum group. Examples of suitable metal alloysinclude, but not limited to, stainless steel, nickel, cobalt, chromium,aluminum-titanium-zirconium, hafnium, niobium, molybdenum, tantalum,tungsten, tin, gallium, manganese and iron-containing alloys, andsuper-alloys based on nickel, iron, cobalt, stainless steel. Forexample, the heating element 28 may be formed of nickel aluminide, amaterial with a layer of alumina on the surface, iron aluminide andother composite materials, the electrically resistive material mayoptionally be embedded in, encapsulated or coated with an insulatingmaterial or vice-versa, depending on the kinetics of energy transfer andthe external physicochemical properties required. The heating element 28may include at least one material selected from the group consisting ofstainless steel, copper, copper alloys, nickel-chromium alloys, superalloys and combinations thereof. In some example embodiments, theheating element 28 may be formed of nickel-chromium alloys oriron-chromium alloys. In some example embodiments, the heating element28 may be a ceramic heater having an electrically resistive layer on anoutside surface thereof. In some example embodiments, the heatingelement 28 may include a porous ceramic material. In some exampleembodiments, the heating element 28 may include one or more resistiveelements, including one or more wires, included within a ceramicmaterial, where the ceramic material may include a porous ceramicmaterial.

The heating element 28 may heat a pre-vapor formulation by thermalconduction. Alternatively, heat from the heating element 28 may beconducted to the pre-vapor formulation by means of a heat conductiveelement or the heating element 28 may transfer heat to the incomingambient air that is drawn through the e-vaping device 60 during vaping,which in turn heats the pre-vapor formulation by convection.

In some example embodiments, the vaporizer assembly 22 may include aheating element 28 that is a porous material which incorporates aresistance heater formed of a material having a high electricalresistance capable of generating heat quickly.

In some example embodiments, the cartridge 70 may be replaceable. Inother words, once one of the flavorant or the pre-vapor formulation ofthe cartridge is depleted, only the cartridge 70 may be replaced. Insome example embodiments, the entire e-vaping device 60 may be disposedonce the reservoir 24 is depleted.

In some example embodiments, the e-vaping device 60 may be about 80 mmto about 110 mm long and about 7 mm to about 8 mm in diameter. Forexample, in some example embodiments, the e-vaping device 60 may beabout 84 mm long and may have a diameter of about 7.8 mm.

In some example embodiments, a pre-vapor formulation may include one ormore flavorants. A flavorant may include one or more of a naturalflavorant or an artificial (“synthetic”) flavorant. A flavorant mayinclude one or more plant extracts. In some example embodiments, aflavorant is one or more of tobacco flavor, menthol, wintergreen,peppermint, herb flavors, fruit flavors, nut flavors, liquor flavors,and combinations thereof. In some example embodiments, a flavorant isincluded in a botanical material. A botanical material may includematerial of one or more plants. A botanical material may include one ormore herbs, spices, fruits, roots, leaves, grasses, or the like. Forexample, a botanical material may include orange rind material andsweetgrass material. In another example, a botanical material mayinclude tobacco material.

In some example embodiments, the tobacco material may include materialfrom any member of the genus Nicotiana. In some example embodiments, thetobacco material includes a blend of two or more different tobaccovarieties. Examples of suitable types of tobacco materials that may beused include, but are not limited to, flue-cured tobacco, Burleytobacco, Maryland tobacco, Oriental tobacco, Dark Tobacco, rare tobacco,specialty tobacco, blends thereof and the like. The tobacco material maybe provided in any suitable form, including, but not limited to, tobaccolamina, processed tobacco materials, such as volume expanded or puffedtobacco, processed tobacco stems, such as cut-rolled or cut-puffedstems, reconstituted tobacco materials, blends thereof, and the like. Insome example embodiments, the tobacco material is in the form of asubstantially dry tobacco mass.

FIG. 2A is a perspective view of a vaporizer assembly 22 according tosome example embodiments. FIG. 2B is a cross-sectional view along lineIIB-IIB′ of the vaporizer assembly of FIG. 2A. FIG. 2C is across-sectional view along line IIC-IIC′ of the vaporizer assembly ofFIG. 2A. In some example embodiments, the vaporizer assembly 22illustrated in FIGS. 2A-C may be the vaporizer assembly 22 illustratedin the cartridge 70 of FIGS. 1A-B.

The vaporizer assembly 22 includes a reservoir 24, a channel structure25, and a heating element 28. The reservoir 24 includes an outer housing202 and a sealing element 204 (e.g., an O-ring element) that at leastpartially define an interior 201 of the reservoir 24. The reservoir 24may hold a pre-vapor formulation in the reservoir interior 201. Theouter housing 202, sealing element 204, and at least a portion ofchannel structure 25 define an interior 201 of reservoir 24. Reservoir24 holds a pre-vapor formulation within the interior 201.

In some example embodiments, including the example embodimentsillustrated in at least FIGS. 2A-C and FIG. 3 below, the channelstructure 25 includes a channel surface 216 that includes first andsecond channel surface portions 212-1 and 212-2, respectively. The firstchannel surface portion 212-1 of the channel surface 216 defines aboundary of the reservoir interior 201, such that the first channelsurface portion 212-1 of the channel surface 216 is in fluidcommunication with the reservoir interior 201.

The channel structure 25 includes open-microchannels 220-1 to 220-N atthe channel surface 216. “N” may be a positive integer having a value ofat least one (1). The open-microchannels 220-1 to 220-N extend betweenthe first and second channel portions 212-1 and 212-2. In some exampleembodiments, one or more of the open-microchannels 220-1 to 220-N is agroove in the channel surface 216. The depth of each open-microchannel220-1 to 220-N extends, orthogonally to a longitudinal axis of theopen-microchannel 220-1 to 220-N, from the channel surface 216 into aninterior of the channel structure 25. The open microchannels 220-1 to220-N may draw pre-vapor formulation from the reservoir 24 based oncarrying the pre-vapor formulation through the open-microchannels 220-1to 220-N from the first channel surface portion 212-1 to the secondchannel surface portion 212-2.

The portions of the open-microchannels 220-1 to 220-N extending throughthe first channel surface portion 212-1 are in fluid communication withthe reservoir interior 201. The portions of the open-microchannels 220-1to 220-N extending through the first channel surface portion 212-1 mayreceive pre-vapor formulation from the reservoir interior 201. Theopen-microchannels 220-1 to 220-N may carry the received pre-vaporformulation from the first channel surface portion 212-1 to the secondchannel surface portion 212-2, based on capillary action of theopen-microchannels 220-1 to 220-N.

The second channel surface portion 212-2 is restricted from being indirect fluid communication with the reservoir interior 201. The secondchannel surface portion 212-2 is restricted from being in direct fluidcommunication with pre-vapor formulation held in the reservoir interior201. As shown in FIGS. 2A and 2C, the sealing element 204 seals orsubstantially seals an interface 230 with the channel surface 216, suchthat pre-vapor formulation flow from the reservoir interior 201 isrestricted to flow through the open-microchannels 220-1 to 220-N.

In some example embodiments, including the example embodimentsillustrated in FIGS. 2A-C, the vaporizer assembly 22 includes one ormore heating elements 28 configured to heat the pre-vapor formulationdrawn to the second channel surface portion 212-2 by theopen-microchannels 220-1 to 220-N. In the example embodiments shown inFIGS. 2A-C, the one or more heating elements 28 are coupled to thechannel structure 25 at the second channel surface portion 212-2.

In some example embodiments, including the example embodimentsillustrated in FIGS. 2A-C, the channel structure 25 includes acylindrical structure 210. The cylindrical structure 210 extends betweenthe reservoir 24 and an exterior of the reservoir 24, such that thecylindrical structure 210 at least partially defines an annularreservoir interior 210 that surrounds the first channel surface portion212-1. In the example embodiments illustrated in FIGS. 2A-C, the channelstructure 25 includes a disc structure 214 that defines a base of thereservoir interior 201. As further shown in FIGS. 2A-C, the channelsurface 216 may extend between the cylindrical and disc structures 210and 214, and the open-microchannels 220-1 to 220-N may extend betweenthe cylindrical and disc structures 210 and 214.

In the example embodiments illustrated in FIGS. 2A-C, the channelstructure 25 includes a continuous curve shape (e.g., absent of surfacevertices and/or edges) between the cylindrical and disc structures 210and 214. Such a continuous curve shape may improve pre-vapor formulationtransport through the open-microchannels 220-1 to 220-N as the amount ofpre-vapor formulation held in the reservoir interior 201 is depleted.For example, as the amount of pre-vapor formulation is depleted, theremaining pre-vapor formulation may form an annular pool surroundingportions of the disc structure 214 such that the pre-vapor formulationremains in fluid communication with open-microchannels 220-1 to 220-Nextending along the disc structure 214. As shown, the open microchannels220-1 to 220-N extend on the cylindrical structure 210 in parallel orsubstantially in parallel with a longitudinal axis of the cylindricalstructure 210, and the open micro-channels 220-1 further extend on thedisc structure 214 radially to the outer boundary of the disc structure214, relative to the cylindrical structure 210.

In some example embodiments, one or more of the cylindrical structure210 and the disc structure 214 may be absent from the channel structure25.

In some example embodiments, the channel structure 25 is configured todraw, from the reservoir 24, pre-vapor formulation having one or morecertain ranges of intrinsic properties. For example, the channelstructures 25 may include one or more open-microchannels 220-1 to 220-Nthat are configured to draw a pre-vapor formulation based on capillaryaction of the open-microchannels 220-1 to 220-N if and/or when thepre-vapor formulation has one or more particular intrinsic properties.

Such intrinsic properties may include viscosity of the pre-vaporformulation. For example, in some example embodiments, one or more ofthe open-microchannels 220-1 to 220-N are configured to draw, based oncapillary action of the one or more open-microchannels 220-1 to 220-N, apre-vapor formulation that has a viscosity ranging from about 1centipoise to about 60 centipoise.

Such intrinsic properties may include material composition of thepre-vapor formulation. For example, in some example embodiments, one ormore of the open-microchannels 220-1 to 220-N is configured to draw,based on capillary action of the one or more open-microchannels 220-1 to220-N, a pre-vapor formulation that includes a mixture of 80% glyceroland 20% propylene glycol by mass.

In some example embodiments, a channel structure 25 may be configured toinclude one or more open-microchannels 220-1 to 220-N throughimplementation of one or more open-microchannel formation processes.Such processes may be implemented by one or more of an operator and amachine device. The machine device may implement such processes based onexecuting one or more instances of computer-executable programinstructions that are stored on one or more instances of non-transitorycomputer-readable storage media.

In some example embodiments, the channel structure 25 is a moldedstructure that is molded to include one or more of theopen-microchannels 220-1 to 220-N, such that the open-microchannels220-1 to 220-N are formed concurrently with the formation of the channelstructure 25 according to the mold via which the channel structure 25 isformed. For example, the channel structure 25 may be a molded PTFEstructure. In some example embodiments, the channel structure may beformed through a three-dimensional (3D) printing process.

In some example embodiments, the channel structure 25 is a caststructure that includes the open-microchannels 220-1 to 220-N, such thatthe open-microchannels 220-1 to 220-N are formed concurrently with theformation of the channel structure 25 according to the cast via whichthe channel structure 25 is formed.

In some example embodiments, the open-microchannels 220-1 to 220-N areformed through removing one or more portions of a channel structure 25.Such formation may include “cutting,” “etching,” “grinding,” somecombination thereof, or the like to form one or more open-microchannels220-1 to 220-N in one or more surfaces of the channel structure 25.

FIG. 3 is a perspective view of a vaporizer assembly 22 according tosome example embodiments. In some example embodiments, the vaporizerassembly 22 illustrated in FIG. 3 may be the vaporizer assembly 22included in the cartridge 70 of FIGS. 1A-B.

Referring to FIG. 3, a vaporizer assembly 22 may include a planar orsubstantially planar channel structure 25 that at least partiallydefines a boundary (“surface”) of a reservoir interior 201 and extendsbeyond the reservoir 24.

As shown in FIG. 3, a planar channel structure 25 includes a channelsurface 216 having first and second channel surface portions 212-1 and212-2. The first and second channel surface portions 212-1 and 212-2 maybe at least partially defined by exposure to the reservoir interior 201.The first channel surface portion 212-1 is a portion of the channelsurface 216 that is in direct fluid communication with the reservoirinterior 201, where the reservoir interior 201 is at least partiallydefined by the channel structure 25, outer housing 202, and base 302.The second channel surface portion 212-2 is a portion of the channelsurface 216 that is restricted from direct fluid communication with thereservoir interior 201. The first and second channel portions 212-1 and212-2 may be defined by interface 230 between a sealing element 204 andthe channel surface 216. The sealing element 204 may seal orsubstantially seal the interface 230, such that pre-vapor formulationflow from the reservoir interiors 201 is restricted to flow through oneor more of the open-microchannels 220-1 to 220-N that extend between thefirst and second channel surface portions 212-1 and 212-2.

The channel structure 25 includes one or more open-microchannels 220-1to 220-N that are configured to draw pre-vapor formulation from thereservoir interior 201. The open-microchannels 220-1 to 220-N extendbetween the first and second channel surface portion 212-1 and 212-2.The open-microchannels 220-1 to 220-N may draw pre-vapor formulationfrom the reservoir interior 201 to the second channel surface portionbased on capillary action of the pre-vapor formulation through theopen-microchannels 220-1 to 220-N.

As shown in FIG. 3, some example embodiments of the vaporizer assembly22 include a heating element 28 that is coupled to the second channelsurface portion 212-2. The heating element 28 may heat pre-vaporformulation drawn to the second channel surface portion 212-2 by theopen-microchannels 220-1 to 220-N. The heating element 28 may therebyvaporize the drawn pre-vapor formulation to form a vapor 95.

In some example embodiments, the vaporizer assembly 22 includes awicking material 390 that is in contact with one or more portions of thesecond channel surface portion 212-2 and the heating element 28. Thewicking material 390 may include a fibrous wicking material. The wickingmaterial 390 may be in fluid communication with one or moreopen-microchannels 220-1 to 220-N in the second channel surface portion212-2. The wicking material 390 may be in fluid communication with theheating element 28 and with the one or more open-microchannels 220-1 to220-N.

The wicking material 390 may couple the one or more open-microchannels220-1 to 220-N to the heating element 28. In some example embodiments,the wicking material 390 may draw pre-vapor formulation from the one ormore open-microchannels 220-1 to 220-N toward the heating element 28,such that the pre-vapor formulation in the wicking material 390 is influid communication with the heating element 28. The pre-vaporformulation drawn from the open-microchannels 220-1 to 220-N by thewicking material 390 may be heated and vaporized by the heating element28.

Examples of suitable materials of wicking material 390 may be, but notlimited to, glass, ceramic- or graphite-based materials. The wickingmaterial 390 may have any suitable capillary drawing action toaccommodate pre-vapor formulations having different physical propertiessuch as density, viscosity, surface tension and vapor pressure.

FIG. 4A is a cross-sectional view of a vaporizer assembly according tosome example embodiments. FIG. 4B is a perspective view of section A ofthe vaporizer assembly of FIG. 4A. In some example embodiments, thevaporizer assembly 22 illustrated in FIGS. 4A-B may be the vaporizerassembly 22 included in the cartridge 70 of FIGS. 1A-B.

Referring to FIGS. 4A-B, in some example embodiments, a vaporizerassembly 22 includes a reservoir that is an annular structure configuredto hold the pre-vapor within the annular structure, the vaporizerassembly 22 further includes a channel structure 25 that is a discstructure, the channel structure 25 includes a first channel surfaceportion 212-1 that is an outer annular channel surface portion of thechannel surface 216 and defines a base of the annular structure of thereservoir 24, and the channel structure 25 includes a second channelsurface portion 212-2 that is an inner channel surface portion of thechannel surface 216. The channel structure 25 may include one or moreopen-microchannels 220-1 to 220-2 that extend radially between the outerannular channel surface portion 212-1 and the inner channel surfaceportion 212-2. In addition, the vaporizer assembly 22 may include aheating element 28 that is coupled to the inner channel surface portion212-2.

In the example embodiments illustrated in FIGS. 4A-B, the vaporizerassembly 22 includes a disc channel structure 25 that defines a base ofthe vaporizer assembly 22. The disc channel structure 25 has an uppersurface that is the channel surface 216. As shown in FIGS. 4A-B, thechannel surface 216 includes open-microchannels 220-1 to 220-N thatextend radially from an inner portion of the disc structure of thechannel structure 25.

In the example embodiments illustrated in FIGS. 4A-B, the vaporizerassembly 22 includes a cylindrical outer housing 202 and an inner tube404 that define an annular reservoir 24 therebetween. The inner tube 404further defines a cylindrical interior space 401 within the inner tube404. As shown, the outer housing 202 and inner tube 404 may be coupledtogether at an upper portion of the vaporizer assembly 22 to define anupper boundary of the reservoir 24. In some example embodiments, agasket (not shown in FIGS. 4A-B) may be coupled to both the inner tube404 and the outer housing 202 to define the upper end of the reservoir24, where the upper end is an opposite end of the reservoir 24, relativeto an end of the reservoir 24 that is at least partially defined by thedisc channel structure 25.

In the example embodiments illustrated in FIGS. 4A-B, the inner tube 404and outer housing 202 are coupled to the disc channel structure 25, suchthat a first channel surface portion 212-1 of the channel surface 216defines a base boundary of the reservoir 24. The first channel surfaceportion 212-1 of the channel surface 216 is an annular outer portion ofthe channel surface 216. The first channel surface portion 212-1 of thechannel surface 216 is in fluid communication with the interior of thereservoir 24. The portions of the open-microchannels 220-1 to 220-N thatextend through the first channel surface portion 212-1 may receivepre-vapor formulation held in the reservoir 24.

As shown in FIGS. 4A-B, the inner tube 404 partitions the channelsurface 216 between first and second channel surface portions 212-1 and212-2. The open-microchannels 220-1 to 220-N may extend radially betweenthe first and second channel surface portions 212-1 and 212-2. Theopen-microchannels 220-1 to 220-N may draw pre-vapor formulation fromthe annular reservoir 24 structure to the second channel surface portion212-2. The second channel surface portion 212-2 shown in FIG. 4A is influid communication with the interior space 401.

In the example embodiments illustrated in FIGS. 4A-B, channel structure25 includes an opening 402 that extends through the inner portion of thechannel structure 25, such that the channel structure 25 is a ringstructure. The opening 402 may be an air inlet port. The vaporizerassembly 22 may be configured to draw air into the interior space 401through the opening 402.

In the example embodiments illustrated in FIGS. 4A-B, the vaporizerassembly 22 includes one or more heating elements 28 that are coupled toa surface that at least partially defines the interior space 401. Asshown in FIG. 4A, the heating element 28 may be coupled to the innertube 404. In some example embodiments, the heating element 28 may becoupled to one or more portions of the second channel surface portion212-2 of the channel surface 216. The heating element 28 may beconfigured to generate heat to heat pre-vapor formulation drawn to thesecond channel surface portion 212-2 of the channel surface 216 by theopen-microchannels 220-1 to 220-N such that a vapor is formed in theinterior space 401.

In the example embodiments illustrated in FIGS. 4A-B, the vaporizerassembly 22 includes an opening 410 that defines an upper end of theinterior space 401. The opening 410 may be at an opposite end of theinterior space 401, relative to the end of the interior space 401 thatis at least partially defined by the channel structure 25. Vapor formedat the channel structure 25, through vaporization of pre-vaporformulation drawn to the second channel surface portion 212-2 of thechannel surface 216, may be drawn through the interior space 401 to exitthe vaporizer assembly 22 through the opening 410. In some exampleembodiments, vapor formed at the second channel surface portion 212-2may be entrained in air drawn into the interior space 401 throughopening 402. The mixture of air and entrained vapor may be drawn throughthe interior space 401 and away from opening 402 towards and through theopening 410.

In the example embodiments illustrated in FIGS. 4A-B, the vaporizerassembly 22 includes one or more vents 412 that extend through the innertube 404 between the interior space 401 and the reservoir 24. In someexample embodiments, the one or more vents 412 may be pressure-reliefvents configured to release one or more fluids (liquids, gasses, etc.)from the reservoir 24 into the interior space 401 if and/or when aninternal pressure within the reservoir is equal to or greater than aparticular threshold pressure.

In some example embodiments, the vaporizer assembly 22 includes awicking material 490 that is in contact with one or more portions of thesecond channel surface portion 212-2 and the heating element 28. Thewicking material 490 may include a fibrous wicking material. The wickingmaterial 490 may be in fluid communication with one or moreopen-microchannels 220-1 to 220-N in the second channel surface portion212-2. The wicking material 490 may be in fluid communication with theheating element 28 and with the one or more open-microchannels 220-1 to220-N.

The wicking material 490 may couple the one or more open-microchannels220-1 to 220-N to the heating element 28. In some example embodiments,the wicking material 490 may draw pre-vapor formulation from the one ormore open-microchannels 220-1 to 220-N toward the heating element 28,such that the pre-vapor formulation in the wicking material 490 is influid communication with the heating element 28. The pre-vaporformulation drawn from the open-microchannels 220-1 to 220-N by thewicking material 490 may be heated and vaporized by the heating element28.

Examples of suitable materials of wicking material 490 may be, but notlimited to, glass, ceramic- or graphite-based materials. The wickingmaterial 490 may have any suitable capillary drawing action toaccommodate pre-vapor formulations having different physical propertiessuch as density, viscosity, surface tension and vapor pressure.

FIG. 5 is a perspective cross-sectional view of a vaporizer assemblyaccording to some example embodiments. In some example embodiments, thevaporizer assembly 22 illustrated in FIG. 5 may be the vaporizerassembly 22 included in the cartridge 70 of FIGS. 1A-B.

Referring to FIG. 5, in some example embodiments, the vaporizer assembly22 includes a channel structure 25 that at least partially encloses areservoir 24, such that a channel surface 216 of the channel structure25 is an inner surface of the channel structure 25. In addition, a firstchannel surface portion 212-1 may at least partially define a boundaryof the reservoir 24 interior.

As shown in FIG. 5, the channel structure 25 may be a hollow cylindricalstructure that defines an interior space 510 having an opening 512 atone end and bounded by the inner surface 216 of the hollow cylindricalstructure. Open-microchannels 220-1 to 220-N may extend between thefirst and second channel surface portions 212-1 and 212-2 bounding theinterior space 510.

The reservoir 24 may be defined by at least the first channel surfaceportion 212-1. The reservoir 24 may further be defined by a sealingelement 204 that seals or substantially seals the interior space 510 atinterface 230. The sealing element 204 may thus partition the interiorspace 510 into a first section, bounded by the first channel surfaceportion 212-1 of the channel surface 216, and a second section, boundedby the second channel surface portion 212-2 of the channel surface 216.The first section may define the reservoir 24. The sealing element 204may restrict pre-vapor formulation flow from the reservoir 24 to flowthrough one or more of the open-microchannels 220-1 to 220-N that extendbetween the first and second channel surface portions 212-1 and 212-2.

In the example embodiments of the vaporizer assembly 22 illustrated inFIG. 5, the channel structure 25 includes one or more air inlet ports504 that extend between an exterior of the channel structure 25 and theinterior space 510. The air inlet ports 504 may direct air into theinterior space 510. Such air directed into the interior space may bedrawn from the interior space 510 through the opening 512 at an end ofthe channel structure 25.

As shown in FIG. 5, open-microchannels 220-1 to 220-N may draw pre-vaporformulation from the first channel surface portion 212-1 that defines aboundary of the reservoir 24 to the second channel surface portion 212-2that defines a boundary of the open interior space 510.

In the example embodiments of the vaporizer assembly 22 illustrated inFIG. 5, the heating element 28 is coupled to the second channel surfaceportion 212-2. The heating element 28 may extend around the innersurface 216, as shown in FIG. 5. As further shown, theopen-microchannels 220-1 to 220-N may extend through the second channelsurface portion 212-2 to be in fluid communication with the heatingelement 28. If and/or when pre-vapor formulation is drawn from thereservoir 24 to at least the second channel surface portion 212-2 by theopen-microchannels 220-1 to 220-N, the heating element 28 may heat thepre-vapor formulation to form a vapor in the interior space 510 boundedby the second channel surface portion 212-2. As further shown in FIG. 5,the heating element 28 may be positioned closer to the opening 512 thanthe distance between the air inlet ports 504 and the opening 512. Thus,pre-vapor formulation vaporized by the heating element 28 may be drawnthrough the opening 512 by air that is drawn into the interior space 510through the one or more air inlet ports 504.

In some example embodiments, the channel structure 25 illustrated inFIG. 5 is at least a part of the outer housing 16 of the cartridge 70illustrated in FIGS. 1A-B. The air inlet ports 504 may be the air inletports 44 illustrated in FIGS. 1A-B.

FIG. 6A, FIG. 6B, FIG. 6C, and FIG. 6D are cross-sectional views ofopen-microchannels according to some example embodiments. In someexample embodiments, the open-microchannels 220-1 illustrated in FIGS.6A-D may be the open-microchannel 220-1 included in any of the exampleembodiments of channel structures 25 included herein, including thechannel structure 25 illustrated in FIG. 1B.

Referring to FIGS. 6A-D, in some example embodiments, one or more of theopen-microchannels 220-1 to 220-N in a channel structure 25 may have oneor more various dimensions, cross-sectional areas, and/or crosssectional area shapes. The dimensions, cross sectional areas, and/orcross sectional area shapes of one or more open-microchannels 220-1 to220-N may be based on one or more properties of the pre-vaporformulations that may be carried by the open-microchannels 220-1 to220-N, respectively.

Referring to FIG. 6A, an open-microchannel 220-1 may have a rectangularcross-sectional area shape, such that the open-microchannel 220-1 has acertain width 602, a certain depth 604, and a certain cross-sectionalarea 610-1. The open-microchannel 220-1 may be configured to transport agiven pre-vapor formulation at one or more flow rates based on one ormore of the width 602, depth 604, cross-sectional area 610-1, and crosssectional area shape of the given open-microchannel 220-1.

Referring to Table 1, below, open-microchannels 220-1 to 220-N may haveone or more various widths and depths. Such open-microchannels 220-1 to220-N may include rectangular open-microchannels 220-1, as shown in FIG.6A. As shown, the width of a rectangular open-microchannel may range,inclusively, from about 100 micrometers to about 300 micrometers. Asalso shown, the depth of open-microchannels 220-1 may range,inclusively, from about 150 micrometers to about 300 micrometers. Itwill be understood that the open-microchannel dimensions illustrated inTable 1 may be dimensions of open-microchannels 220-1 havingnon-rectangular cross-sectional area shapes, as described further below.

TABLE 1 Open-Microchannel Dimensions Cross-Sectional Microchannel SizeWidth (μm) Depth (μm) Area (m²) “Small” microchannel 100 150 1.5 × 10⁻⁸“Medium” microchannel 200 300 6.0 × 10⁻⁸ “Large” microchannel 300 3009.0 × 10⁻⁸

In some example embodiments, a rate at which pre-vapor formulation isdrawn by an open-microchannel 220-1 may be based on one or more of thedimensions and cross sectional area of the open-microchannel 220-1. Forexample, an individual “small” open-microchannel 220-1 may be configuredto draw a given pre-vapor formulation at a rate of approximately 0.01microliters per second. In another example, an individual “medium”open-microchannel 220-1 may be configured to draw the given pre-vaporformulation at a rate of approximately 0.06 microliters per second. Inanother example, an individual “large” open-microchannel 220-1 may beconfigured to draw the given pre-vapor formulation at a rate ofapproximately 0.09 microliters per second.

In some example embodiments, the quantity of open-microchannels 220-1 to220-N included in a channel structure 25 may be inversely proportionalto one or more of the dimensions and cross sectional area of theopen-microchannels 220-1 to 220-N. For example, a channel structure 25that includes a plurality of “large” open-microchannels (300 μm wide and300 μm deep) may have a smaller quantity of open-microchannels 220-1 to220-N than a channel structure 25 that includes a plurality of “small”open-microchannels (100 μm wide and 150 μm deep).

Accordingly, in some example embodiments a total rate at which pre-vaporformulation is drawn by a channel structure 25 may be based on one ormore of the dimensions and cross sectional area of theopen-microchannels 220-1 to 220-N included in the channel structure 25.

For example, a channel structure 25 that includes multiple “small”open-microchannels 220-1 to 220-N may be configured to draw pre-vaporformulation at a total rate of about 0.5 micro-liters/sec. In anotherexample, a channel structure 25 that includes multiple “large”open-microchannels 220-1 to 220-N may be configured to draw pre-vaporformulation at a total rate of about 4.0 micro-liters/sec.

Referring to FIG. 6B, an open-microchannel 220-1 may have a triangularcross-sectional area shape, such that the open-microchannel 220-1 has acertain width 602, a certain depth 604, and a certain triangularcross-sectional area 610-2. While the example embodiments illustrated inFIG. 6B illustrate an open-microchannel having an equilateral triangularcross-sectional area 610-2, it will be understood that theopen-microchannel 220-1 may have one or more various triangularcross-sectional area shapes, including an isosceles triangular shape, aright-triangular shape, and a scalene triangular shape. Theopen-microchannel 220-1 may be configured to transport a given pre-vaporformulation at one or more flow rates based on one or more of the width602, depth 604, cross-sectional area 610-2, and cross sectional areashape of the given open-microchannel. Referring back to Table 1, thetriangular open-microchannel 220-1 may, in some example embodiments,have a width 602 that is equal to one of the widths included in Table 1.Still referring to Table 1, the triangular open-microchannel 220-1 may,in some example embodiments, have a depth that is equal to one of thedepths included in Table 1.

Referring to FIG. 6C, an open-microchannel 220-1 may have a paraboliccross-sectional area shape, such that the open-microchannel 220-1 has acertain width 602, a certain depth 604, and a certain paraboliccross-sectional area 610-3. While the example embodiments illustrated inFIG. 6C illustrate an open-microchannel having a semi-circularcross-sectional area 610-3, it will be understood that theopen-microchannel 220-1 may have one or more various paraboliccross-sectional area shapes. The open-microchannel 220-1 may beconfigured to transport a given pre-vapor formulation at one or moreflow rates based on one or more of the width 602, depth 604,cross-sectional area 610-3, and cross sectional area shape of the givenopen-microchannel. Referring back to Table 1, the parabolicopen-microchannel 220-1 may, in some example embodiments, have a width602 that is equal to one of the widths included in Table 1. Stillreferring to Table 1, the parabolic open-microchannel 220-1 may, in someexample embodiments, have a depth that is equal to one of the depthsincluded in Table 1.

Referring to FIG. 6D, an open-microchannel 220-1 may have a trapezoidalcross-sectional area shape, such that the open-microchannel 220-1 has acertain first width 602, a certain second width 603, a certain depth604, and a certain trapezoidal cross-sectional area 610-4. In someexample embodiments, the first width 602 may be greater than the secondwidth 603. The first width 602 may be greater than the second width 603to simplify formation of the open-microchannel 220-1. Theopen-microchannel 220-1 may be configured to transport a given pre-vaporformulation at one or more flow rates based on one or more of the width602, depth 604, cross-sectional area 610-3, and cross sectional areashape of the given open-microchannel. Referring back to Table 1, thetrapezoidal open-microchannel 220-1 may, in some example embodiments,have a first width 602 that is equal to one of the widths included inTable 1. Still referring to Table 1, the trapezoidal open-microchannel220-1 may, in some example embodiments, have a second width 603 that isequal to one of the widths included in Table 1. Still referring to Table1, the trapezoidal open-microchannel 220-1 may, in some exampleembodiments, have a depth that is equal to one of the depths included inTable 1.

FIG. 7 is a cross-sectional view of an open-microchannel and ahydrophilic layer according to some example embodiments. In some exampleembodiments, the channel surface 216 and open-microchannel 220-1illustrated in FIG. 7 may be the channel surface 216 andopen-microchannel 220-1 included in any of the example embodiments ofchannel structures 25 included herein, including the channel structure25 illustrated in FIG. 1B.

As described above, in some example embodiments, the channel structure25 may include a hydrophilic material. Referring to FIG. 7, in someexample embodiments, a channel structure 25 may include a hydrophiliclayer 702 on one or more of the channel surface 216 and one or moreopen-microchannels 220-1 to 220-N. In some example embodiments, thehydrophilic layer 702 may include a layer of one or more materials. Forexample, the hydrophilic layer 702 may include polyethylene glycol(PEG). The hydrophilic layer 702 may include a PEG coating on one ormore of the channel surface 216 and one or more open-microchannels 220-1to 220-N. In some example embodiments, the hydrophilic layer 702 may beapplied to one or more of the channel surface 216 and one or moreopen-microchannels 220-1 to 220-N according to one or more graftingprocesses. In some example embodiments, a plasma activation process maybe implemented with regard to one or more of the channel surface 216 andone or more open-microchannels 220-1 to 220-N, through plasmaprocessing, such that the one or more of the channel surface 216 and oneor more open-microchannels 220-1 to 220-N is configured to behydrophilic. The one or more of the channel surface 216 and one or moreopen-microchannels 220-1 to 220-N may retain a plasma activated state ifand/or when the one or more of the channel surface 216 and one or moreopen-microchannels 220-1 to 220-N is in contact with a fluid. Plasmaactivation, through plasma processing, may include removal of weakboundary layers from the one or more of the channel surface 216 and oneor more open-microchannels 220-1 to 220-N, cross-linking of surfacemolecules in one or more of the channel surface 216 and one or moreopen-microchannels 220-1 to 220-N, generation of polar groups in one ormore of the channel surface 216 and one or more open-microchannels 220-1to 220-N, some combination thereof, or the like.

In some example embodiments, including the example embodimentsillustrated in FIG. 7, the hydrophilic layer 702 is on both at least aportion of the channel surface 216 and the one or more microchannelsurfaces 701 of the open-microchannel 220-1. As shown in FIG. 7, thehydrophilic layer 702 may have a first layer portion 704-1 that is onthe channel surface 216 and a second layer portion 704-2 that is on theone or more microchannel surfaces 701.

A hydrophilic layer 702 on the channel structure 25 may configure thechannel structure 25 to draw pre-vapor formulation through theopen-microchannels 220-1 to 220-N at an improved rate. For example, thehydrophilic layer 702 may improve transport of a pre-vapor formulationthrough the open-microchannel 220-1 based on improved capillary actionof the pre-vapor formulation through the open-microchannel 220-1.

In some example embodiments, the first layer portion 704-1 may be absentfrom the channel structure 25, such that the hydrophilic layer 702 isrestricted to portion 704-2 that is on the microchannel surfaces 701 andis absent from the channel surface 216. The first layer portion 704-1may be removed subsequent to application of the hydrophilic layer 702 onboth the channel surface 216 and the microchannel surfaces 701. Forexample, the hydrophilic layer 702 may be applied according to one ormore various layer application methods (coating, deposition, etc.). Thefirst portion 704-1 of the layer may be removed according to one or morelayer removal methods (e.g., etching, grinding, etc.), such that thesecond layer portions 704-2 remains.

FIG. 8 is a perspective view of a vaporizer assembly 22 according tosome example embodiments. In some example embodiments, the vaporizerassembly 22 illustrated in FIG. 8 may be the vaporizer assembly 22included in the cartridge 70 of FIGS. 1A-B.

Referring to FIG. 8, a vaporizer assembly 22 may include multiplereservoirs 804-1 to 804-N. Each reservoir 804-1 to 804-N may hold adifferent pre-vapor formulation. The vaporizer assembly 22 may includeone or more partitions 810-1 to 810-N that each separate at least tworeservoirs 804-1 to 804-N.

As shown in FIG. 8, the channel structure 25 may at least partiallydefine the boundaries of each of the reservoirs 804-1 to 804-N. Thechannel structures 25 may include multiple channel surface portions212-1 that are each in fluid communication with a separate reservoir ofthe reservoirs 804-1 to 804-N. As shown in FIG. 8, for example, acylindrical channel structure 25 may define a portion of the sideboundary of each of the reservoirs 804-1 to 804-N, such that the channelstructure 25 includes multiple separate first channel surface portions212-1 of the channel surface 216, and each separate first channelsurface portion 212-1 is in fluid communication with a separatereservoir 804.

In some example embodiments, including the example embodimentsillustrated in FIG. 8, the channel structure 25 includes multiple sets802-1 to 802-N of open-microchannels 220-1 to 220-N. Each separate set802-1 to 802-N may include at least one open-microchannel of theopen-microchannels 220-1 to 220-N. Each separate set 802-1 to 802-N ofopen-microchannels extends through a separate first channel surfaceportion 212-1 of the channel surface. Thus, each separate set 802-1 to802-N of open-microchannels may be at least partially in fluidcommunication with a different reservoir 804-1 to 804-N. Thus, eachseparate set 802-1 to 802-N of open-channel microchannels may beconfigured to draw pre-vapor formulation from a different reservoir804-1 to 804-N.

If and/or when two or more of the reservoirs 804-1 to 804-N holddifferent pre-vapor formulations, separate sets 802-1 to 802-N ofopen-microchannels may draw different pre-vapor formulations from thedifferent reservoirs 804-1 to 804-N, respectively.

Separate sets 802-1 to 802-N of open-microchannels may have differentdimensions, properties, etc. For example, the set 802-1 may include acertain quantity of microchannels that have a certain width, a certaindepth, and a certain cross-sectional area shape. In another example, theset 802-2 may include a separate quantity of open-microchannels,relative to the open-microchannels included in the set 802-1. The set802-2 may include one or more open-microchannels that have one or moreof a separate width, a separate depth, and a separate cross-sectionalarea shape, relative to the open-microchannels included in the set802-1. In another example, the set 802-1 of open-microchannels mayinclude a hydrophilic layer on the surfaces of the open-microchannels,and a hydrophilic layer may be absent from the set 802-2 ofopen-microchannels.

Separate sets 802-1 to 802-N of open-microchannels may have differentdimensions, properties according to different pre-vapor formulationsthat may be held in the reservoirs 804-1 to 804-N, respectively. In someexample embodiments, separate sets 802-1 to 802-N of open-microchannelsmay have different dimensions, properties according to differentpre-vapor formulation flow rates associated with the separate,respective reservoirs 804-1 to 804-N to which the separate sets 802-1 to802-N of open-microchannels are in fluid communication.

The vaporizer assembly 22 may include one or more heating elements 28(not shown in FIG. 8) that may be configured to vaporize pre-vaporformulation drawn from one or more of the reservoirs 804-1 to 804-Nthrough one or more sets of open-microchannels 220-1 to 220-N. In someexample embodiments, an individual heating element 28 may be configuredto vaporize multiple pre-vapor formulations drawn from separate,respective reservoirs 804-1 to 804-N through separate, respective sets802-1 to 802-N of open-microchannels.

FIG. 9A, FIG. 9B, FIG. 9C, and FIG. 9D are perspective views ofvaporizer assemblies according to some example embodiments. In someexample embodiments, one or more of the vaporizer assemblies 22illustrated in FIGS. 9A-D may be the vaporizer assembly 22 illustratedin the cartridge 70 of FIGS. 1A-B. Referring to FIGS. 9A-D, a vaporizerassembly 22 may include a channel structure 25 that has a cylindricalstructure.

Referring to FIG. 9A, a vaporizer assembly 22 may include a heatingelement 28 that includes a surface heater 902. The surface heater 902may contact at least a portion of the channel surface 216 of the channelstructure 25. The surface heater 902, in some example embodiments, atleast partially defines an enclosure of a portion of one or moreopen-microchannels 220-1 to 220-N. The one or more open-microchannelsmay thus include a closed-microchannel portion. As shown in the exampleembodiments illustrated in FIG. 9A, the closed-microchannel portions ofthe open-microchannels 220-1 to 220-N may be defined by the channelstructure 25 and the surface heater 902.

In some example embodiments, the surface heater 902 at least partiallyfills a cross-sectional area of one or more open-microchannels 220-1 to220-N, thereby establishing a flow terminus for pre-vapor formulationthat may flow through the one or more open-microchannels 220-1 to 220-N.Pre-vapor formulation that may flow through the open-microchannels 220-1to 220-N may flow in contact with the surface heater 902.

In some example embodiments, a surface heater 902 may include one ormore of a planar heater, a conformal heater, some combination thereof,or the like. In the example embodiments illustrated in FIG. 9A, forexample, the surface heater 902 is a conformal heater that surrounds aportion of the channel structure 25.

In some example embodiments, including the embodiments illustrated inFIG. 9A, the heater 902 may be at least partially wrapped about acircumference of a cylindrical structure of the channel structure 25.Such a heater 902 may extend along at least a portion of a length (“L”)of the channel structure 25.

In some example embodiments, the surface heater 902 may be in contactwith a portion of an outer circumference of the cylindrical structure ofchannel structure 25. The conformal planar surface heater 902 may extendalong a particular proportion of the structure 25 circumference. Aconformal planar surface heater 902 may include a heater elementarranged in one or more patterns. The one or more patterns may include awave pattern. The wave pattern may include a sinusoidal wave pattern ofheater elements. The sinusoidal waves included in the sinusoidal wavepattern may be spaced apart by a particular distance.

As shown in the example embodiments illustrated in FIG. 9A, the surfaceheater 902 may include a conformal ring surface heater that extendscompletely around the circumference of the channel structure 25. Theconformal ring surface heater 902 may include a heater element arrangedin one or more patterns. The one or more patterns may include a wavepattern. The wave pattern may include a sinusoidal wave pattern ofheater elements. The sinusoidal waves included in the sinusoidal wavepattern may be spaced apart by a particular distance. The conformal ringsurface heater may extend along a particular proportion of a length “L”of the channel structure 25. In some example embodiments, the heatersare resistive heaters.

A surface heater, including a conformal heater, planar heater, etc., maybe a flexible heater. A flexible heater may be a thick film heaterconstructed of one or more thick films. A flexible heater may includeone or more resistive traces arranged in a pattern of resistive traceson a substrate. The substrate may be a flexible substrate. The flexibleheater may include one or more adhesive layers configured to bond theflexible heater to a surface, including a gel formulation surface. Anadhesive layer may include a pressure sensitive adhesive (PSA) layer.

A thick film heater may be a printed thick film heater where a patternof resistive traces included in the thick film heater is a pattern of anink material printed on a film substrate layer. The ink material mayinclude a resistive ink. The film may include a PSA layer applied to thesubstrate on which the ink is printed. The thick film heater may includeanother layer laminated to the substrate and ink layer with the PSAlayer. In some example embodiments, a film layer includes a 0.05-inchthick thermoplastic or thermoset polymer substance, where the substanceis configured to exhibit thermal conductivity while providing electricalinsulation. For example, the film layer may be formed of polyester orpolyimide. An additional layer of PSA may be applied to an exteriorsurface of the thick film heater, such that the thick film heater may bebonded directly to the channel structure 25, thereby enhancing thermaltransfer between the heater 902 and the channel structure 25. Heat maybe transferred to pre-vapor formulation carried in open-microchannels220-1 to 220-N through conduction through the channel structure 25.

In some example embodiments, a thick film heater includes a substrateconstructed from one or more of polyester, polyethylene, polyvinylchloride, thermoset laminate, polyethylene napthalate, polyimide,silicone rubber, or some combination thereof. A thick film heater mayinclude a PSA layer formed of one or more of acrylic materials orsilicone materials. A thick film heater may have a minimum width of 6mm. A thick film heater may have a dielectric strength of up to 1500VAC. A thick film heater may have a watt density of up to 25 W/squareinches. A thick film heater may have an operating voltage of up to about277 VAC or 277 VDC. A thick film heater may have an overall maximumoperating temperature of about 482 degrees Celsius.

In some example embodiments, a flexible heater includes one or more of asingle-sided heater, a double-sided heater, a multi-layer heater, arigid-flex heater, and some combination thereof. A single sided heaterincludes a single heating element layer, which may be a resistive trace.A double sided heater includes two heating element layers. A flexibleheater may include a sculptured heating element, where a sculpturedheating element has variable thickness through the heater structure. Asculptured heating element may have bare metal portions exposed from theheater structure. A rigid-flex heater includes at least one rigid layerand at least one flexible layer. A flexible heater may have a thicknessof at least 0.004 inches. A flexible heater may include at least twoparallel traces having different resistances. The parallel traces may beseparately, selectively activated to provide different rates of heating.A flexible heater may have a bend radius that is about 10 times thethickness of the flexible heater. One or more heating elements in theflexible heater may be radiused resistive traces. Where a flexibleheater includes multiple layers of parallel heating elements, theseparate layers may have a staggered configuration, thereby providingaugmented flexibility of the flexible heater.

In some example embodiments, a surface heater 902 includes a solid stateheater. A solid state heater may include a heating element that is oneor more sets of resistive traces. A solid state heater may be a ceramicsolid state heater. A solid state heater may be constructed from acombination of platinum and at least one ceramic material. A solid stateheater may have a three-dimensional heating element geometric structure.A solid state heater may include multiple separate heating elements. Asolid state heater may include an aluminum nitride ceramic material. Asolid state heater may include a ceramic material and one or moreinternal resistance traces. A resistance trace may be constructed fromtungsten. A solid state heater may include Aluminum nitride (ALN)ceramic and tungsten. Where a solid state heater includes ALN andtungsten, the tungsten metal and ALN may be bonded via chemical bonding.An oxide phase may be inter-diffused between the ALN and Tungsten metal.

A solid state heater may have a linear coefficient of expansion perdegree Celsius of about 4.3×10⁻⁶. A solid state heater may have a DCbreakdown of 14 KV/mil, a Young's Modulus of about 322 GPa, a flexuralstrength of about 350 MPa, a thermal conductivity of about 130 W/m-k at200 degrees Celsius, a thermal conductivity of about 180 W/m-k at roomtemperature, a dielectric loss of about 1.2×10⁻⁴ at room temperature anda frequency of 1 mhz, a dielectric constant of about 8.5-8.7 at roomtemperature and a frequency of 1 mhz, and some combination thereof. Insome example embodiments, a planar heater includes a planar metalsurface heater.

Referring to FIG. 9B, a vaporizer assembly 22 may include a heatingelement 28 that includes a coil heater 904. The coil heater 904 may bewrapped about the circumference of the channel surface 216 of thechannel structure 25. The coil heater 904, in some example embodiments,may include a particular quantity of coils around the channel structure25. The coil heater 904 may be spaced a particular distance from thesurface of the cylindrical body 50. The coils may be spaced a particulardistance apart.

The coil heater 904 may include a wire coil. The wire coil may include ametal wire. The wire coil may extend fully or partially along the lengthof the dispensing interface. The wire coil may further extend fully orpartially around the circumference of the channel structure 25. In someexample embodiments, the wire coil may be isolated from direct contactwith the channel structure 25.

Referring to FIG. 9C, a vaporizer assembly 22 may include a heatingelement 28 that includes an inductive coil heater 906. The inductivecoil heater 906 may not contact a channel surface 216 of the channelstructure 25. The inductive coil heater 906 may be referred to as beingisolated from contacting a surface 216 of the channel structure 25. Theinductive coil heater 902 may be configured to heat the pre-vaporformulation carried in the open-microchannels 220-1 to 220-N to atemperature sufficient to vaporize the pre-vapor formulation. Theinductive coil heater 906 may include a particular quantity of coilsaround the channel structure 25. The inductive coil heater 906 coils maybe spaced a particular distance 910 from the surface 216 of the channelstructure 25.

A heating element 28 that includes an inductive coil heater 906 may beconfigured to apply inductive heating by transferring energy from aprimary coil (not shown in FIG. 9C) to the coil heater 906, where thecoil heater 906 is a secondary coil.

Referring to FIG. 9D, a vaporizer assembly 22 may include a heatingelement 28 that includes a surface heater 912. The surface heater 912may be positioned on an end of the channel structure 25. As shown in theexample embodiments illustrated in FIG. 9D, the surface heater 912 maybea surface heater that is in contact with the channel structure 25. Thesurface heater 912 may be configured to transfer heat to pre-vaporformulation carried in the open-microchannels via conduction through thechannel structure 25.

In some example embodiments, if and/or when the open-microchannels 220-1to 220-N extend to the end of the channel structure 25, the surfaceheater 912 may establish a terminus of the open-microchannels 2201- to220-N at the end of the channel structure 25. Pre-vapor formulationdrawn to the end of the channel structure 25 through theopen-microchannels 220-1 to 220-N may be in contact with one or moreportions of the surface heater 912. The surface heater 912 may transferheat to the pre-vapor formulations based at least in part uponconduction between the surface heater 912 and the pre-vapor formulationat an interface between the surface heater 912 and the pre-vaporformulation at the end of the channel structure 25.

In some example embodiments, the surface heater 912 may be one or moreof a planar heater, a conformal heater, a ring heater, some combinationthereof, etc. A surface heater, including a conformal heater, planarheater, etc., may be a flexible heater. A flexible heater may be a thickfilm heater constructed of one or more thick films. A flexible heatermay include one or more resistive traces arranged in a pattern ofresistive traces on a substrate. The substrate may be a flexiblesubstrate. The flexible heater may include one or more adhesive layersconfigured to bond the flexible heater to a surface, including a gelformulation surface. An adhesive layer may include a pressure sensitiveadhesive (PSA) layer.

A thick film heater may be a printed thick film heater where a patternof resistive traces included in the thick film heater is a pattern of anink material printed on a film substrate layer. The ink material mayinclude a resistive ink. The film may include a PSA layer applied to thesubstrate on which the ink is printed. The thick film heater may includeanother layer laminated to the substrate and ink layer with the PSAlayer. In some example embodiments, a film layer includes a 0.05-inchthick thermoplastic or thermoset polymer substance, where the substanceis configured to exhibit thermal conductivity while providing electricalinsulation. For example, the film layer may be formed of polyester orpolyimide. An additional layer of PSA may be applied to an exteriorsurface of the thick film heater, such that the thick film heater may bebonded directly to the channel structure 25, thereby enhancing thermaltransfer between the heater 912 and the channel structure 25.

In some example embodiments, a thick film heater includes a substrateconstructed from one or more of polyester, polyethylene, polyvinylchloride, thermoset laminate, polyethylene napthalate, polyimide,silicone rubber, or some combination thereof. A thick film heater mayinclude a PSA layer formed of one or more of acrylic materials orsilicone materials. A thick film heater may have a minimum width of 6mm. A thick film heater may have a dielectric strength of up to 1500VAC. A thick film heater may have a watt density of up to 25 W/squareinches. A thick film heater may have an operating voltage of up to about277 VAC or 277 VDC. A thick film heater may have an overall maximumoperating temperature of about 482 degrees Celsius.

In some example embodiments, a flexible heater includes one or more of asingle-sided heater, a double-sided heater, a multi-layer heater, arigid-flex heater, and some combination thereof. A single sided heaterincludes a single heating element layer, which may be a resistive trace.A double sided heater includes two heating element layers. A flexibleheater may include a sculptured heating element, where a sculpturedheating element has variable thickness through the heater structure. Asculptured heating element may have bare metal portions exposed from theheater structure. A rigid-flex heater includes at least one rigid layerand at least one flexible layer. A flexible heater may have a thicknessof at least 0.004 inches. A flexible heater may include at least twoparallel traces having different resistances. The parallel traces may beseparately, selectively activated to provide different rates of heating.A flexible heater may have a bend radius that is about 10 times thethickness of the flexible heater. One or more heating elements in theflexible heater may be radiused resistive traces. Where a flexibleheater includes multiple layers of parallel heating elements, theseparate layers may have a staggered configuration, thereby providingaugmented flexibility of the flexible heater.

In some example embodiments, a surface heater 912 includes a solid stateheater. A solid state heater may include a heating element that is oneor more sets of resistive traces. A solid state heater may be a ceramicsolid state heater. A solid state heater may be constructed from acombination of platinum and at least one ceramic material. A solid stateheater may have a three-dimensional heating element geometric structure.A solid state heater may include multiple separate heating elements. Asolid state heater may include an aluminum nitride ceramic material. Asolid state heater may include a ceramic material and one or moreinternal resistance traces. A resistance trace may be constructed fromtungsten. A solid state heater may include Aluminum nitride (ALN)ceramic and tungsten. Where a solid state heater includes ALN andtungsten, the tungsten metal and ALN may be bonded via chemical bonding.An oxide phase may be inter-diffused between the ALN and Tungsten metal.

In some example embodiments, a surface heater 902, 912 may include oneor more various heater shapes, including serpentine heaters, which maycontact one or more surfaces of the channel structure 25.

FIG. 10 is a flowchart illustrating a method for forming a vaporaccording to some example embodiments. The method may be implemented bya vaporizer assembly. Such a vaporizer assembly may include any of theexample embodiments of vaporizer assemblies 22 included herein,including any of the example embodiments of vaporizer assemblies 22illustrated in any of FIGS. 1-9C. However, the embodiments of vaporizerassembly that may implement the method illustrated in FIG. 10 are notlimited to the example embodiments illustrated in one or more of FIGS.1-9C.

As described above, a vaporizer assembly includes a reservoir that holdsa pre-vapor formulation, a channel structure configured to drawpre-vapor formulation from the reservoir through one or moreopen-microchannels, and a heating element.

At 1002, the vaporizer assembly draws a pre-vapor formulation from areservoir based on capillary action of the pre-vapor formulation throughone or more micro-channels of the channel structure. The channelstructure includes a channel surface with first and second portions. Thefirst portion of the channel surface is in fluid communication with thereservoir interior and the second portion of the channel surface isexternal to the reservoir. The channel surface includes one or moreopen-microchannels extending between the first and second portions ofthe channel surface, such that portions of the open-microchannelsextending through the first portion of the channel surface are in fluidcommunication with the reservoir interior. Portions of theopen-microchannels extending through the first portion of the channelsurface may receive pre-vapor formulation from the reservoir interior.The open-microchannels may draw pre-vapor formulation from the reservoirinterior based on drawing the pre-vapor formulation through theopen-microchannels from the first portion of the channel surface to thesecond portion of the channel surface.

At 1004, the vaporizer assembly carries pre-vapor formulation to theheating element. As described above, open-microchannels extendingbetween the first and second portions of the channel surface may carrypre-vapor formulation from the reservoir. The open-microchannels maycarry the pre-vapor formulation to at least a certain proximity of aheating element, such that the pre-vapor formulation in theopen-microchannels may receive a sufficient amount of heat generated bythe heating element to vaporize. In some example embodiments, one ormore heating elements may be coupled to the open microchannels. Theopen-microchannels may carry pre-vapor formulation to physical contactwith one or more heating elements.

At 1006, the vaporizer assembly vaporizes the pre-vapor formulationcarried by the open-microchannels to the second portion of the channelsurface. Such vaporization may include generating heat by the heatingelement, such that the pre-vapor formulation carried to the secondportion of the channel surface is heated by the heating element and atleast partially vaporizes. The vapor may be released from theopen-microchannels.

While a number of example embodiments have been disclosed herein, itshould be understood that other variations may be possible. Suchvariations are not to be regarded as a departure from the spirit andscope of the present disclosure, and all such modifications as would beobvious to one skilled in the art are intended to be included within thescope of the following claims.

We claim:
 1. A method, comprising: drawing a pre-vapor formulation from a reservoir to a heating element through at least one open-microchannel, the at least one open-microchannel including a first portion and a second portion, the first portion being in fluid communication with the reservoir, the second portion being coupled to the heating element; and vaporizing the pre-vapor formulation drawn to the heating element through the at least one open-microchannel to form a vapor.
 2. The method of claim 1, further comprising: drawing the pre-vapor formulation to the heating element through a plurality of parallel open-microchannels.
 3. The method of claim 1, further comprising: drawing a plurality of pre-vapor formulations from a plurality of reservoirs to at least one heating element through a plurality of open-microchannels, each of the open-microchannels being in fluid communication with a separate reservoir of the plurality of reservoirs; and vaporizing the pre-vapor formulations drawn to the at least one heating element through the plurality of open-microchannels to form at least one vapor. 